IMOS
ChipMOS TECHNOLOGIES Inc.NASDAQTechnologyAs of 2026-04-06
Valuation
View DetailsP/E (TTM)
81.01
PEG
—
P/B
1.67
P/S
1.65
EV/EBITDA
6.93
DCF Value
$78.00
FCF Yield
0.3%
Div Yield
2.2%
Margins & Returns
Gross Margin
10.8%
Operating Margin
4.8%
Net Margin
2.1%
ROE
2.1%
ROA
1.1%
ROIC
2.4%
Financials
View All| Period | Revenue | Net Income | EPS |
|---|---|---|---|
| Q4 2025 | $6.65B | $502.4M | $14.20 |
| FY 2025 | $23.93B | $497.8M | $14.00 |
| Q3 2025 | $6.14B | $352.2M | $10.00 |
| Q2 2025 | $5.74B | $-533.1M | $-15.00 |
Trading Activity
Insider Trades
View AllCompany Info
Sector
Technology
Industry
—
Country
TW
Exchange
NASDAQ
Beta
0.87
ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.