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IMOS ChipMOS TECHNOLOGIES Inc.

USTechnology
$74.37+9.26%ClosedMarket Cap: $2.60B

As of 2026-07-09 16:00

Why IMOS matters now

ChipMOS TECHNOLOGIES Inc. (IMOS) is a US stock in Technology. The latest InvestLog snapshot shows $74.37 with +9.26% on the session and $2.60B in market capitalization; recent performance reads 1-month +35.88% and YTD +124.70%.

The latest financial table shown here is Q1 2026, with revenue of $6.94B, net income of $504.9M, and EPS of $14.40. Investors can compare that operating picture with valuation signals such as P/E 87.72 and FCF yield -0.4%.

The latest indexable market news headline is "ChipMOS Technologies: A Hidden Memory Supercycle Play" from Seeking Alpha.

Additional event context on this page matters because analyst consensus is Buy with a median target of $—; recent insider activity includes Cheng Shih Jye filing . These signals are research inputs, not a recommendation.

Valuation

P/E (TTM)

87.72

PEG

P/B

2.96

P/S

2.85

EV/EBITDA

11.80

DCF Value

$46.04

FCF Yield

-0.4%

Div Yield

1.2%

Margins & Returns

Gross Margin

12.0%

Operating Margin

5.1%

Net Margin

3.3%

ROE

3.5%

ROA

1.8%

ROIC

2.6%

Financials

PeriodRevenueNet IncomeEPS
Q1 2026$6.94B$504.9M$14.40
Q4 2025$6.65B$502.4M$14.20
FY 2025$24.06B$497.8M$14.00
Q3 2025$6.14B$352.2M$10.00

Analyst Ratings

Consensus

Buy

Target (Consensus)

$—

Target (Median)

$—

Target Range

$— - $—

Strong Buy: 0Buy: 1Hold: 0Sell: 0Strong Sell: 0

Trading Activity

Insider Trades

Cheng Shih Jyedirector, officer: President
Sell2026-03-16
Cheng Shih Jyedirector, officer: President
Sell2026-03-16
Cheng Shih Jyedirector, officer: President
Sell2026-03-16
Yang Hong-Tzer
Sell2026-03-13
Chien Kun-Yi
Sell2026-03-13

Latest News

Company Info

Sector

Technology

Industry

Semiconductors

Country

TW

Exchange

Beta

1.29

ChipMOS TECHNOLOGIES INC. conducts research, development, manufacturing, and global sales of advanced, highly integrated, and precise integrated circuits. Headquartered in Hsinchu, Taiwan, and founded in 1997, the company also provides essential back-end assembly and testing services across key international markets, including Taiwan, mainland China, Japan, and Singapore. Its operations are structured across various segments, encompassing Testing, Assembly, Bumping, and specialized Testing and Assembly for LCD, OLED, and other display panel driver semiconductors, in addition to other related business areas. ChipMOS offers a comprehensive suite of back-end services: for memory and logic/mixed-signal semiconductors, these include engineering tests, wafer probing, final testing, and package assembly utilizing leadframe and organic substrate technologies. For display panel driver semiconductors, such as those used in LCDs and OLEDs, the company delivers gold bumping, reel-to-reel assembly, and testing solutions. The integrated circuits and services provided by ChipMOS are integral to a wide array of products, spanning personal computers, graphics applications like game consoles, telecommunications equipment, mobile devices including cellular phones, tablets, and various consumer electronics, as well as automotive, industrial, and display panel sectors.